RRC
工艺涂胶胶厚均匀性优化研究
江月艳
;
张世权
【摘
要】
Some method had been used to reduce the semiconductor
manufacture cost, such as reducing photo resist consumption, which result
in the uniformity of photo resist becoming more lager. Photo resist
uniformity and thickness are the important process parameter which could
influence the quality of exposal process. By changing chuck rotation speed,
pump velocity, exhaust, the best process condition for RRC process has
been accomplished, the relationship between photo resist uniformity and
other process condition has been developed;The photo resist uniformity
and thickness can be controlled steadily and make sure the steady of the
fab process.%
为降低涂胶工序的生产成本，减少光刻胶的用量，需要在涂胶工艺
上不断改进和提高。从原来传统的涂胶工艺到
RRC
（
Reduced Resist
Consumption
）工艺，能够使光刻胶的用量减少，而随着光刻胶用量的减少，圆
片上胶厚的均匀性也在发生剧烈的变化。同时光刻涂胶工序最重要的工艺要求就是
胶厚和均匀性，它直接影响着后续曝光工艺的稳定性。在
RRC
工艺下，通过对喷
胶转速、排风、喷胶速率等涂胶参数进行多次试验，最终找出影响胶厚均匀性的参
数及其调整方法，来达到工艺要求的胶厚及均匀性，保障工艺生产的稳定性。
【期刊名称】
《电子与封装》
【年
(
卷
),
期】
2014(000)008
【总页数】
3
页
(P42-44)
